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zxbm5210 document number: ds36765 rev. 1 - 2 1 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 reversible dc motor dri ve with speed control description the zxbm5210 is a single chip solution for driving a single-coil reversible direct current (dc) fans and motors. the integrated full- bridge driver output stage is desi gned to minimize audible switching noise and electromagnetic interferenc e (emi) providing a low noise solution for system flexibility, the device has four modes of operation: forward, reverse, brake and standby selected via fwd and rev pins. the forward and reverse modes provide the motor rotation direction control, the brake mode allows quick stop and the standby mode helps system efficiency by powering down most of the internal circuits to consume less than 32ua typical. the motor speed can be adjusted by changing the duty ratio of the pwm signal on the fwd or rev pins in the pwm mode or alternatively by adjusting dc voltage input signal to the v ref pin in the vref speed control mode. to help protect the ic and the motor coil the zxbm5210 includes under voltage, over voltage, over current and over temperature protections. once the safe operating range has been exceeded the device shuts down the output drive to help prevent over stress on the ic or the coil. the device internal current protection threshold is 1.5a typical. the zxbm5210 is available in the standard so8 and thermally enhanced so8-ep packages. features ? supports single-coil reversible dc motor applications ? operating voltage: 3v to 18v ? four modes of operations: forward, reverse, brake and standby ? low quiescent current of 0.85ma typical in normal operation and 32a in standby mode ? internal over current protection ? under voltage lockout and over voltage protection ? over temperature protection ? -40 c to +85 c /105 c operating temperature ? 6kv esd withstand capability ? standard so-8 and thermally enhanced so-8ep ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) pin assignments so-8 so-8ep applications ? 5v / 9v/ 12v / 15v dc reversible motors and actuators ? home appliances ? handheld power tools ? valve open and close ? remote control motorized toys ? medium voltage/ low power dc motors notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds.
zxbm5210 document number: ds36765 rev. 1 - 2 2 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 typical applications circuit note: 4. c1 is for power stabilization and to strengthen the noise immunity, the recommended capa citance is 100nf to 1f or mor e. c2 is a re-circulating capacitor for back rush voltage and re commended capacitance is 100nf for low current applications to 10 f or more for large current applications. see application note section pin descriptions package: so-8 pin # pin name function 1 out1 driver output 2 v m power supply voltage 3 v dd power supply voltage 4 fwd forward control input (logic level, 5.5v max) 5 rev reverse control input (logic level, 5.5v max) 6 v ref input reference voltage to set the internal pwm oscillator duty ratio 7 out2 driver output 8 gnd ground package: so8-ep pin # pin name function 1 out1 driver output 2 v m power supply voltage 3 v dd power supply voltage 4 fwd forward control input (logic level, 5.5v max) 5 rev reverse control input (logic level, 5.5v max) 6 v ref input reference voltage to set the internal pwm oscillator duty ratio 7 out2 driver output 8 gnd ground pad pad the exposed pad is for thermal dissipation and it is internally connected to the ground. on the pcb layout, it can be connected to gnd or left open circuit.
zxbm5210 document number: ds36765 rev. 1 - 2 3 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 functional block diagram absolute maximum ratings (note 5) @t a = +25c, unless otherwise specified.) symbol characteristic values unit v m and v dd, supply voltage (note 6) 24 v v out1, v out2 v ref all other pins except fwd and rev pins 24 v v fwd and v rev fwd and rev pin voltage 7 v v reverse reverse supply voltage on all pins -0.3 v i output output current (source and sink)- peak 1500 ma p d package power dissipation so8 (note 7) 1043 mw so8-ep (note 8) 2980 mw ts storage temperature range -65 to +150 c t j maximum junction temperature 150 c esd hbm human body model esd withstand capability v dd , v m , v ref , fwd, rev, gnd and out1 out2 pins 6 kv notes: 5. stresses greater than the 'absolute maximum ratings' sp ecified above, may cause permane nt damage to the device. these are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. device reliability may be affected by exposure to absolu te maximum rating conditions for extended periods of time 6. the absolute maximum supply voltage of 24 v is a transient stress rating and is no t meant as a functional operating conditio n. it is not recommended to operate the device at the absolute maximum rated conditions for any period of time. 7. so-8 soldered to minimum recommended landing pads (see package outline dimension section) on a 1?x1? two-layer 2oz.copper fr4 pcb (1.6mm thickness) without any via or copper flood on the bottom la yer. see thermal de-rating curves in the thermal performance section. 8. so-8ep exposed pad soldered to minimum recommended landing pads (see package outline dimension section) on a 2?x2? two-layer 2oz.copper fr4 pcb (1.6mm thickness) with four therma l vias in the exposed pad to the copper flood on the bottom layer. see thermal de-rat ing curves in the thermal performance section. recommended operating conditions symbol characteristic conditions min max unit v dd supply voltage operating 3 18 v t a operating temperature range operating, so8 package -40 +85 c operating, so8-ep package -40 +105 c
zxbm5210 document number: ds36765 rev. 1 - 2 4 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 electrical characteristics (note 9)(@t a = +25c, v dd = 12v, unless otherwise specified.) symbol characteristics conditions min typ max unit i dd supply current no load ? 0.85 2.5 ma i dd_stndby standby supply current fwd=rev=low (gnd) ? 32 45 ua v uv_th under voltage lock out threshold voltage decreasing ? 2.6 ? v v uvlo_r under voltage lock out release threshold voltage increasing ? 2.8 3.0 v v uv_hys under voltage hysteresis voltage increasing ? 200 ? mv v ov_th overvoltage threshold voltage increasing ? 20.7 24 v v ov_rlth overvoltage release threshold voltage decreasing 17.0 19 ? v v oh output voltage high i out = 300ma, t a = - 40 c to +105 c v dd - 0.25 v dd - 0.15 ? v i out =500ma t a = - 40 c to +105 c v dd - 0.43 v dd - 0.25 ? v v ol output voltage low i out = 300ma, t a = - 40 c to +105 c ? 0.15 0.25 v i out = 500ma, t a = - 40 c to +105 c ? 0.25 0.43 v v oh + v ol output voltage of n- and pmos and bond wire voltage drop combined i out = 300ma, t a = - 40 c to +105 c ? 0.3 0.5 v i out = 500ma, t a = - 40 c to +105 c ? 0.5 0.86 v i out = 300ma, v dd = 3v t a = - 40 c to +105 c ? 0.39 0.66 v r on_total combined n- and pmos r dson including bond wire resistance i out = 500ma, t a = - 40 c to +105 c ? 1 1.72 i out = 300ma, v dd = 3v t a = - 40 c to +105 c ? 1.3 2.2 i lim_th over current protection threshold 1.2 1.5 a v ref v ref voltage range ( dc voltage speed control mode) 3 ? v dd (18v max) v i vref v ref bias current ( dc voltage speed control mode) v ref = v dd -15 0 15 a f out output pwm switching frequency (internal pwm oscillator) vref control mode 20 26.5 35 khz pwm speed control mode 20 ? 100 khz f fwd_rev input pwm frequency of speed control signal pwm control mode 20 ? 100 khz t dead dead time between current reversal v dd = 3v to 18v t a = - 40 c to +105 c 2.1 3 3.9 s t sdn_delay shutdown delay ? inter nal circuits active after fwd = rev = l (except from brake mode) fwd = gnd rev = gnd 125 180 ? s v fwdh fwd input h level 2 ? 5.5 v v fwdl fwd input l level 0 ? 0.8 v i fwdh fwd pin current ? h level fwd pin: v fwd = 5v ? 50 ? a i fwdl fwd pin current ? l level fwd pin: v fwd = 0v ? 50 ? a v revh rev input h level 2 ? 5.5 v v revl rev input l level 0 ? 0.8 v i revh rev pin current ? h level rev pin: v rvs = 5v ? 50 ? a i revl rev pin current ? l level rev pin: v rvs = 0v ? 50 ? a d pwm_min output minimum duty ratio 0% 100 % tj_ sdn_th ic junction temperature thermal shutdown threshold ? 165 ? o c tj_ sdn_hyst ic junction temperature thermal shutdown hysteresis ? 25 ? o c note : 9. typical data is at t a = +25 c, v dd = 12v. the maximum and minimum paramet ers values over the operating temperature range are not tested in production, they are guaranteed by des ign, characterization and process control.
zxbm5210 document number: ds36765 rev. 1 - 2 5 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 application note rotation control and standby modes the device has fwd and rev pins for contro lling the motor rotation directions. the dev ice has four motor operation modes: 1) s tandby mode, 2) forward mode, 3) reverse mode and 4) brake mode. the four modes are controlled by the fwd and rev logic pins. fwd rev v ref out1 out2 operating mode l l x open open standby mode ? all switches are off h l 3v to v dd h l forward mode ? current flows from out1 to out2; v ref duty control l h 3v to v dd l h reverse mode ? current flows from out2 to out1; v ref duty control h h x l l brake mode ? short circui t brake with low side switches on pwm l v dd h pwm forward mode ? current flows from out1 to out2; pwm control mode l pwm v dd pwm h reverse mode ? current flows from out2 to out1; pwm control mode h h x l l brake mode ? short circui t brake with low side switches on in the brake mode, switches s2 and s4 are on allowing the moto r to stop quickly. all the internal control circuits are fully op erational. in the standby mode all the output drive switches are off and addi tionally, the internal circuits are also turned off to minimi ze power consumption. the power consumption in the standby mode is less than in t he brake mode. if running motor enters the standby mode, due to the body diodes the motor free wheels to idle state. whenever the motor enters the standby mode from any mode (except the brake mode) the contr ol logic will remain active in previous mode for at l east 125s before shutting down the internal circuits. to prevent device entering the st andby mode during operating mode changes, the mode change signal s should be completed within 125s. in the forward mode, with switches s1-s2 on and s3-s4 off, out1 is high and out2 is low. the motor current flows from out1 to o ut2. in the reverse mode, switches s1-s4 are on while s1-s2 are off to allow motor current flow from out2 to out1. in the forward or reverse mode, for v ref speed control, the output drive duty ratio is generated internally based on the voltage on the v ref pin. for pwm speed control, external pwm signals app lied to the fwd or rev pins control th e pwm switching of the low side s2 (forwa rd mode) or s4 (reverse mode). see application section for further details. the zxbm5210 has three modes of speed control: v ref speed control mode, pwm speed control mo de and by adjusting the supply voltage m s1 s2 s4 off off off standby mode gnd s3 off supply out1 out2 s1 s2 s3 s4 on on off off brake mode m supply gnd out2 out1
zxbm5210 document number: ds36765 rev. 1 - 2 6 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 application note (cont.) motor speed control with dc voltage on v ref pin motor speed can be controlled by adjusting the dc voltage into the v ref pin. the output drive pwm duty ratio is defined by the ratio of the v ref voltage to the supply v dd voltage. in v ref speed control mode, fwd and rev pins are only used for dire ction control and therefore high frequency pwm control signal shoul d not be applied to the fwd and rev pins. if repetitive direction c hanges required, it is recommended to keep direction change frequ ency of below 400hz. the speed and direction control is given by: fwd rev v ref out1 out2 operating mode l l x open open standby mode ? all switches are off h l v dd h l forward mode ? current flows from out1 to out2; 100% duty h l 3v to v dd h l forward mode ? current flows from out1 to out2; v ref duty control l h v dd l h reverse mode ? current flows from out2 to out1; 100% duty l h 3v to v dd l h reverse mode ? current flows from out2 to out1; v ref duty control h h x l l brake mode ? short circui t brake with low side switches on motor speed control with a pwm input signal motor speed can be controlled by adjusting the duty cycle of the pwm speed control signal into the fwd or rev while keeping the v dd pin at the nominal motor voltage. in this mode the input voltage on the v ref pin must be greater than or equal to v dd . in pwm speed control mode the high side switches s1 and s3 are kept fixed while the low side switches s2 or s4 are switched. in the forward mode, s1 is kept switched on, s2 is switched in accordance wi th the pwm signal and s3 and s4 are switched off. in reverse mode, s3 is switched on, s4 is switched in accordance with the pwm signal and s1 and s2 are switched off. the speed and direction control is given by: fwd rev v ref out1 out2 operating mode l l x open open standby mode ? all switches are off h l v dd h l forward mode ? current flows from out1 to out2; 100% duty l h v dd l h reverse mode ? current flows from out2 to out1; 100% duty h h x l l brake mode ? short circui t brake with low side switches on pwm l v dd h pwm forward mode ? current flows from out1 to out2; pwm control mode l pwm v dd pwm h reverse mode ? current flows from out2 to out1 pwm control mode h h x l l brake mode ? short circui t brake with low side switches on the motor speed is proportional to the input pwm si gnal duty. for example, for a 12v motor the v dd pin is maintained at 12v while varying the pwm control signal duty to adjust the motor speed linearly. the timing diagram below shows the output o1 and o2 in relation to pwm speed control signal at pwm pin. frequency of pwm speed control signal can be between 8khz to 100khz. recommended typica l pwm signal frequency is 25khz to keep switching frequency away from the audible band.
zxbm5210 document number: ds36765 rev. 1 - 2 7 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 application note (cont.) motor speed control with a pwm input signal (cont.) depending on the motor design and its inertia the minimum start-up pwm duty required can be typically between 30% - 50%. while the motor is rotating minimum pwm duty can generally be re duced down to 20%. how small the pwm duty can be without stalling the motor depend s on the motor mechanical and coil design parameters and not limited by the output capability of the device. if voltage at v dd is lower than the nominal motor voltage, both start-up pwm duty and minimum running pwm duty required will be higher. motor speed control by dc supply voltage motor speed can be controlled by varying the v dd supply voltage while the fwd and rev pins are set to either a logic high or low depending on forward or reverse direction needed. the v ref must be equal to v dd in this mode. for example, if the v dd for a 12v motor is changed from 12v to 3v the speed will be reduced from 100% to 25%. re-circulating capacitor during motor operation when the low side switch is turned off the bridge or the motor voltage may overshoot to high levels if t here is no current path for the energy in the motor to flow. such high voltages can damage the ic. a current path can be provided by adding a bypa ss capacitor from the v dd or v m to the gnd. the value of the bypass capacitor depends on the moto r coil design, motor current, motor voltage and the ic voltage limits. this could be in the range of 0.47f for low current applications to 10uf or more for large current applicat ions. dead-time during motor current reversal (for motor rotation direction re versal), switch position changes between s1-s2 and s3-s4. such ch ange may result in cross conduction between high side and low si de mosfets, e.g. s1 and s4 or s2 and s3 . to prevent cross conduction the ic pr ovides a dead time 3s typical during current reversal or fast turn on of the low side mosfets. back-rush voltage depending on motor characteristics, the environment and the ambient conditions back-rush voltage (at the bridge) may fluctuate during brush commutation and pwm switching. due to the energy in the coil this back-rush voltage can reach high levels if no adequate altern ative current path is provided when inductor current path is interrupted. t he back-rush voltage overshoot should not be allowed to go beyond the operating voltage range of the ic. this backrush voltage overshoot can be mi nimized by using a re-circula ting bypass capacitor at the v dd and v m pins. the value of the re-circulating bypass capacitor depends on the motor coil design, motor current, motor voltage and the ic volt age limits. this could be 0.47f for low current applications to 10uf or more for large current applications. under voltage lockout to make sure the minimum voltage needed to operate the driver is supplied, the driver has an under voltage lock out. at start u p the device will only start if the supply voltage is typically 2.8 or greater. during normal operation, the device will switch off all the outpu t switches and power down if the supply voltage drops below 2.6v typical. over voltage protection when the supply voltage exceeds 20.7v (typical ) the driver will turn-off all the output switches. the driver will return to nor mal condition if the supply voltage drops below 19v (typical) pr ovided no other fault condition or signals ar e preventing it to enter normal operati on. in-rush current it is recommended to use the pwm duty cycle to control the aver age voltage supplied to the motor during power up, standby mode, brake mode or during motor direction reversal. if a pw m signal is not available it is recommended to use a current limiting resistor or o ther protection devices if needed. over-current setting and protection the internal over current protection (ocp) thre shold is 1.5a typical at 12v supply +25c. when the motor current exceeds the ocp threshold for longer t han 10s typical on any of the h-bridge switches, the device will switch of all the output switches and remain off for 5ms typical. the ic returns to normal operation after the 5ms if over current condition has gone away. if the motor current is still higher than the ocp threshold, the device will enter another 5ms standby mode. thermal shutdown the device has an internal thermal shutdown to prevent a therma l run-away scenario. the thermal shutdown is triggered when the junction temperature of the device reaches +165c. it will remain in standby mode until the junction temperature falls by +25c. reverse voltage protection if reverse protection is needed th is can be achieved by adding an external diode to the v dd and v m pins.
zxbm5210 document number: ds36765 rev. 1 - 2 8 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 application note (cont.) motor electromagnetic and audible noise to help reduce electromagnetic and audible nose, capacitor can be conn ected from out1 to gnd and out2 to gnd pins. alternative ly, a capacitor can be connected between out1 and ou t2 with diodes between the output pins and gnd as shown below. to prevent large c urrents it is recommended to keep any capacitor used at the out put pins as small as possible and less than 1f.
zxbm5210 document number: ds36765 rev. 1 - 2 9 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 typical operating characteristics supply current standby current under voltage lockout (uvlo) over voltage protection (ovp) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2468101214161820 supply current i dd (ma) supply voltage (v) supply current vs. supply voltage t a = +25 c 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 supply current i dd (ma) temperature (c) supply current vs. temperature 12v 3v 18v 0 10 20 30 40 50 60 2468101214161820 stanby current i dd_stndby (ua) supply voltage (v) standby supply current vs. supply voltage t a = +25 c 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 -50-25 0 255075100125 standby current i dd (ma) temperature (c) standby supply current vs. temperature 12v 3v 18v 2.0 2.3 2.5 2.8 3.0 3.3 3.5 -50 -25 0 25 50 75 100 125 uvlo thresholds (v) temperature (c) uvlo trigger and release thresholds vs temperature uvlo release threshold uvlo trigger threshold 15.0 17.0 19.0 21.0 23.0 25.0 -50 -25 0 25 50 75 100 125 ovp thresholds (v) temperature (c) ovp trigger and release thresholds vs temperature ovp release threshold ovp trigger threshold
zxbm5210 document number: ds36765 rev. 1 - 2 10 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 typical operating characteristics output pwm duty in pwm speed control mode ou tput pwm duty in vref speed control mode pwm oscillator frequency 0 10 20 30 40 50 60 70 80 90 100 0 102030405060708090100 output pwm duty (%) input pwm duty (%) output pwm duty vs input pwm duty 12v 3v 18v t a = 25 o c, mode a pwm, input pwm frequency 25khz 0 10 20 30 40 50 60 70 80 90 100 0 0.2 0.4 0.6 0.8 1 output pwm duty (%) v ref /v dd ratio outputpwm duty vs v ref /v dd ratio 12v 3v 18v t a = 25 o c, vref mode, no load 20 22 24 26 28 30 2 4 6 8 10 12 14 16 18 20 frequency (khz) supply voltage (v) pwm oscillator frequency vs. supply voltage t a = 25 o c 20 22 24 26 28 30 -50 -25 0 25 50 75 100 125 frequency (khz) temperature (c) pwm oscillator frequency vs. temperature 12v 3v 18v
zxbm5210 document number: ds36765 rev. 1 - 2 11 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 typical operating characteristics low side switch on voltage (v ol ) high side switch on voltage (v dd - v oh ) 0.0 0.1 0.2 0.3 0.4 0.5 0 2 4 6 8 101214161820 low side swicth on voltae (v) supply voltage (v) low side switch on voltage v ol vs. supply voltage i out = 300ma t a = +25 c 0.0 0.1 0.2 0.3 0.4 0.5 0 2 4 6 8 101214161820 low side swicth on voltae (v) supply voltage (v) low side switch on voltage v ol vs. supply voltage i out = 500ma t a = +25 c 0.0 0.1 0.2 0.3 0.4 0.5 -50-25 0 255075100125 low side switch on voltage (v) temperature (c) low side switch on voltage v ol vs. temperature 12v 3v 18v i out = 300ma 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50-25 0 255075100125 low side switch on voltage (v) temperature (c) low side switch on voltage v ol vs. temperature 12v 3v 18v i out = 500ma 0.0 0.1 0.2 0.3 0.4 0.5 0 2 4 6 8 101214161820 high side switch on voltae (v) supply voltage (v) high side switch on voltage (v dd -v oh ) vs supply voltage i out = 300ma t a = +25 c 0.0 0.1 0.2 0.3 0.4 0.5 0 2 4 6 8 101214161820 high side switch on voltae (v) supply voltage (v) high side switch on voltage (v dd -v oh ) vs supply voltage i out = 500ma t a = +25 c
zxbm5210 document number: ds36765 rev. 1 - 2 12 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 typical operating characteristics high side switch on voltage (v dd - v oh ) (cont.) h-bridge resistance ? total resistance on (r dson _ total ) of the high and the low side switches 0.0 0.1 0.2 0.3 0.4 0.5 -50-25 0 255075100125 high side switch on voltage (v) temperature (c) highside switch on voltage (v dd -v ol ) vs. temperature 12v 3v 18v i out = 300ma 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 125 high side switch on voltage (v) temperature (c) highside switch on voltage (v dd -v ol ) vs. temperature 12v 3v 18v i out = 500ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 02468101214161820 r ds_on_total ( ) supply voltage (v) high+low side resistance r dson_total vs. voltage i out = 300ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 02468101214161820 r ds_on_total ( ) supply voltage (v) high+low side resistance r dson _ total vs. voltage i out = 500ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50-25 0 255075100125 r dson_total ( ) temperature (c) high+low side on resistance r dson_total vs. temperature 12v 3v 18v i out = 300ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 -25 0 25 50 75 100 125 r dson_total ( ) temperature (c) high+low side on resistance r dson_total vs. temperature 12v 3v 18v i out = 500ma
zxbm5210 document number: ds36765 rev. 1 - 2 13 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 thermal performance (1) package type: so-8 msop8-ep power dissipation de-rating curve (note 11) t a ( c) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150 p d (mw) 1043 1043 1043 835 751 668 584 543 501 459 417 376 334 250 209 167 83 0 note: 11. so-8 soldered to minimum recommended landing pads (see package outline dimension section) on a 1?x1? two-layer 2oz. copper fr4 pcb (1.6mm thickness) wit hout any via or copper flood on the bottom layer. (2) package type: so-8ep so-8ep power dissipation de-rating curve (note 12) t a ( c) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150 p d (mw) 2980 29080 2980 2384 2146 1907 1669 1550 1430 1430 1192 1073 954 715 596 477 238 0 note: 12. so-8ep exposed pad soldered to minimum recommended land ing pads (see package outline dimension section) on a 2?x2? tw o-layer 2oz.copper fr4 pcb (1.6mm thickness) with four therma l vias in the exposed pad to the copper flood on the bottom layer 0 200 400 600 800 1000 1200 -40 -20 0 20 40 60 80 100 120 140 160 power dissipation (mw) temperature (c) so-8 thermal derating curve rthja = 120 o c/w; rthjc ? = ? 19.9 ? o c/w ? 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 3250 3500 -40 -20 0 20 40 60 80 100 120 140 160 power dissipation (mw) temperature (c) so-8ep thermal derating curve rthja = 42.1 o c/w; rthjc = 8.5 o c/w
zxbm5210 document number: ds36765 rev. 1 - 2 14 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 ordering information part number package code packaging 13? tape and reel quantity part number suffix ZXBM5210-S-13 s so-8 2500/tape & reel -13 zxbm5210-sp-13 sp so-8ep 2500/tape & reel -13 marking information (1) package type: so-8 part number package identification code ZXBM5210-S-13 so-8 bm5210 yy ww xx (2) package type: so-8ep part number package identification code zxbm5210-sp-13 so-8ep bm5210 yy ww xx e
zxbm5210 document number: ds36765 rev. 1 - 2 15 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com/ datasheets/ap02002.pdf for latest version. (1) package type: so-8 (2) package type: so-8ep so-8 dim min max a - 1.75 a1 0.10 0.20 a2 1.30 1.50 a3 0.15 0.25 b 0.3 0.5 d 4.85 4.95 e 5.90 6.10 e1 3.85 3.95 e 1.27 typ h - 0.35 l 0.62 0.82 0 8 all dimensions in mm so-8ep (sop-8l-ep) dim min max typ a 1.40 1.50 1.45 a1 0.00 0.13 - b 0.30 0.50 0.40 c 0.15 0.25 0.20 d 4.85 4.95 4.90 e 3.80 3.90 3.85 e0 3.85 3.95 3.90 e1 5.90 6.10 6.00 e - - 1.27 f 2.75 3.35 3.05 h 2.11 2.71 2.41 l 0.62 0.82 0.72 n - - 0.35 q 0.60 0.70 0.65 all dimensions in mm gauge plane seating plane detail ?a? detail ?a? e e1 h l d e b a2 a1 a 45 7 ~ 9 a3 0.254 gauge plane seating plane e1 e n e b a 45 e0 h f exposed pad bottom view l q c 7 4 3 9 (all sides) a1 d 14 85
zxbm5210 document number: ds36765 rev. 1 - 2 16 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (1) package type: so-8 (2) package type: so-8ep dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 dimensions value (in mm) c 1.270 x 0.802 x1 3.502 x2 4.612 y 1.505 y1 2.613 y2 6.500 x c1 c2 y c y1 x1 x y y2 x2
zxbm5210 document number: ds36765 rev. 1 - 2 17 of 17 www.diodes.com december 2013 ? diodes incorporated new product zxbm5210 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com

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